Khoom siv

FR-4, nyob-TgFR-4, LeadfreeMaterials (RoHSCompliant), CEM-3, CEM-1, Aluminium,

HighfrequencyMaterial(Rogers,Teflon,Taconic)

LayerNo.

1-20Layers

Boardthickness

0.0075andquot;(0.2mm)-0.125andquot;(3.2mm)

BoardThicknessTolerance

±10%

Copperthickness

0.5 OZ - 4 OZ

ImpedanceControl

±10%

Warpage

0.075%-1.5%

Peelable

0.012andquot; (0.3 hli)-0.02'(0.5 hli)

MinTraceWidth(a)

0.005andquot;(0.125mm)

MinSpaceWidth(b)

0.005andquot;(0.125mm)

MinAnnularRing

0.005andquot;(0.125mm)

SMDPitch(a)

0.012andquot;(0.3mm)

pcbwithgreensoldermaskandLF-FREEsurfacefinishingBGAPitch(b)

0.027andquot;(0.675mm)

Regesitertolerance

hli 0.05

MinSolderMaskDam(a)

0.005andquot;(0.125mm)

SoldermaskClearance(b)

0.005andquot;(0.125mm)

MinSMTPadspacing(c)

0.004andquot;(0.1mm)

SolderMaskThickness

0.0007andquot;(0.018mm)

Holesize

0.01andquot;(0.25mm)--0.257andquot;(6.5mm)

HoleSizeTol(+/-)

±0.003andquot; (±hli 0.0762)

AspectRatio

6:01

HoleRegistration

0.004andquot;(0.1mm)

HASL

2.5um

LeadfreeHASL

2.5um

ImmersionGold

Nickel3-7umAu:1-3uand #39; thiab #39;

OSP

0.2-0.5um

PanelOutlineTol(+/-)

±0.004''(±0.1 hli)

Beveling

30°45°

V-ntuag

15°30°45°60°

Surfacefinish

HAL, HASLLeadFree, Immersiongold, Goldplating, Goldfinger,

immersionsilver, immersionTin, OSP, Carbonink,

Daim ntawv pov thawj

ROHSISO9001:2000TS16949SGSUL

Specialrequirements

Buriedandblindvias, Impedancecontrol, viaplug, BGAsolderingandgoldfinger